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AMPAK - Smart Internet of Things

Smart Internet of Things Wireless RF Module Expert Professional Brand


Zhengji Technology is a company with more than 20 years of experience in wireless module R&D, design, production, marketing and product technology integration services.

We have a professional team of high-frequency module hardware design and software integration engineers with rich customer application experience. We can respond to customer and market-oriented product and technical support needs and provide a series of SiP and industry standard modules to serve regions around the world. Regardless of consumer customer groups or industrial application customers, Zhengji can provide complete suggestions and solutions by applying its products to the construction of smart home, security, Internet of Things, remote office or industrial automation, smart medical, smart transportation and other service systems. With a positive service attitude, from economical and practical products to high-end industrial standard products, we can satisfy a broad customer base and exceed customer expectations.

AP6181

Appearance Stamp type


Size 12x12mm


Frequency band 2.4GHz


Certification FCC/CE pre-scan


Wi-Fi Specifications Support Wi-Fi® 4

Single-stream can achieve up to a speed of 72.2Mbps


Wi-Fi interface SDIO


Operating interface -30 °C to 85 °C


Supported drivers Linux, Android, RTOS


DataSheet


AMPAK Technology® AP6181 is a module with Wi-Fi function. This highly integrated module provides the possibility of multiple applications such as Internet browsing, VoIP, and headsets. In addition, it has unlimited roaming capabilities and advanced security, and can interact with 802.11b/g/n access points from different vendors in the wireless LAN. This wireless module complies with the IEEE 802.11 b/g/n standard. The single-stream speed in the 802.11n specification can reach 72.2Mbps, the speed specified in IEEE 802.11g is 54Mbps, and the speed of IEEE 802.11b when connected to a wireless LAN is 11Mbps. This module specifically provides SDIO interface for Wi-Fi.


AP6212


Appearance Stamp type


Size 12x12mm


Frequency band 2.4GHz


Certification FCC/CE pre-scan andBQB


Wi-Fi Specifications Support Wi-Fi® 4

Single-stream spatial multiplexing up to 72.2 Mbps data rate


Wi-Fi interface SDIO


Bluetooth Specifications Bluetooth® 5.4


Bluetooth interface UART


Operating temperature -30 °C to 85 °C


Supported drivers Linux, Android, RTOS


Datasheet


AMPAK Technology®’s AP6212 is a module with full Wi-Fi and Bluetooth functionality. This highly integrated module provides the possibility of multiple applications such as Internet browsing, VoIP, and Bluetooth headsets. In addition, it has unlimited roaming capabilities, advanced security, and the ability to interact with 802.11b/g/n access points from different vendors in the wireless LAN. The wireless module complies with the IEEE 802.11 b/g/n standard and can achieve speeds up to 72.2Mbps in single antenna transmission of the 802.11n specification, 54Mbps in compliance with IEEE 802.11g, or 11Mbps in compliance with IEEE 802.11b to connect to a wireless LAN. This integrated module provides SDIO interface for Wi-Fi and UART/I2S/PCM interface for Bluetooth. This small module is a combination of Wi-Fi + Bluetooth technology, providing a comprehensive solution. This module is specially developed for portable devices.


AP6256


Appearance Stamp type


Size 12x12mm


Frequency band 2.4GHz/5GHz


Certifications FCC, CE, TELEC, SRRC and BQB


Wi-Fi Specifications Support Wi-Fi® 5

Single-stream spatial multiplexing up to 433.3 Mbps data rate


Wi-Fi interface SDIO


Bluetooth Specifications Bluetooth® 5.4


Bluetooth interface UART


Operating temperature -30 °C to 85 °C


Supported drivers Linux, Android, RTOS


DataSheet


AMPAK Technology® AP6256 is a full-featured Wi-Fi and Bluetooth module with unlimited roaming capabilities and advanced security, and is able to interact with 802.11a/b/g/n/ac 1x1 access points from different vendors in wireless LANs and SISO standards, and can achieve speeds up to 433.3Mbps in 802.11ac via single stream to connect wireless LANs. In addition, AP6256 also includes an SDIO interface for Wi-Fi and a UART/PCM interface for Bluetooth. This module is a combination of Wi-Fi + Bluetooth technology that provides a comprehensive solution and is specially developed for tablets, OTT boxes and portable devices.


AP6611S


Appearance Stamp type


Size 12x12mm


Frequency band 2.4GHz/5GHz/6GHz


Certifications FCC, IC, CE, TELEC and BQB


Wi-Fi Specifications Support Wi-Fi® 6E

Single-stream spatial multiplexing up to 600 Mbps data rate


Wi-Fi interface SDIO


Bluetooth Specifications Bluetooth® 5.3


Bluetooth interface UART/PCM


Operating temperature -30 °C to 85 °C


Supported drivers Linux, Android, RTOS


AMPAK Technology® AP6611S is a fully functional Wi-Fi 6E and Bluetooth module with unlimited roaming capabilities and advanced security. It works with a variety of Wi-Fi 6E or legacy access points/routers, achieving PHY rates up to 500 Mbps on a single stream. In addition, AP6611S supports SDIO v3.0/2.0 interface and provides UART/PCM interface for Wi-Fi through appropriate settings. It also supports Bluetooth. This compact module is a complete solution for Wi-Fi and Bluetooth technology, designed for tablets, OTT boxes and portable/mobile devices.


AP6281S


Appearance Stamp type


Size 12x12mm


Frequency band 2.4GHz/5GHz/6GHz


Certification FCC/CE pre-scan and BQB


Wi-Fi Specifications Support WiFi® 6E

Single-stream spatial multiplexing up to 600 Mbps data rate


Wi-Fi interface SDIO


Bluetooth Specifications Bluetooth® 5.3


Bluetooth interface UART/PCM


802.15.4(Matter over thread) Support


Operating temperature -30 °C to 85 °C


Supported drivers Linux, Android, RTOS


AMPAK Technology® AP6281S is a fully featured Wi-Fi 6E, Bluetooth and IEEE 802.15.4/Thread module with unlimited roaming and advanced security. It works with Wi-Fi 6E or legacy access points/routers from different vendors, achieving PHY rates up to 600Mbps on a single stream. In addition, AP6281S supports the SDIO v3.0 interface through appropriate settings, providing Wi-Fi UART/PCM interface, Bluetooth UART interface and IEEE 802.15.4/Thread UART interface. This compact module is a complete solution for Wi-Fi + Bluetooth technology, developed for tablets, OTT boxes and portable/mobile devices


AP6203BM


Appearance Stamp type


Size 12x12mm


Frequency band 2.4GHz/5GHz


Certification FCC/CE pre-scan,SRRC and BQB


Wi-Fi Specifications Support Wi-Fi® 4

Single-stream spatial multiplexing up to 72.2 Mbps data rate


Wi-Fi interface SDIO


Bluetooth Specifications Bluetooth® 5.4


Bluetooth interface UART


Operating temperature -30 °C to 85 °C


Supported drivers Linux, Android, RTOS


AMPAK Technology® AP6203BM is a module with full Wi-Fi and Bluetooth functions. This highly integrated module provides the possibility of multiple applications such as Internet browsing, VoIP, and Bluetooth headsets. It also features unlimited roaming, advanced security, and the ability to interact with different vendor 802.11 a/b/g/n access points in the wireless LAN. The wireless module complies with IEEE 802.11 a/b/g/n standards and achieves a maximum speed of 72Mbps in single antenna transmission in 802.11n. This integrated module provides SDIO interface for Wi-Fi and UART/PCM interface for Bluetooth. This module is a combination of Wi-Fi + Bluetooth technology group, providing a comprehensive solution. This module is specially developed for portable devices.


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